K4S161622H-TC60  SAMSUNG

Mfr Package Description0.400 X 0.825 INCH, 0.80 MM PITCH, TSOP2-50
REACH CompliantYes
StatusDiscontinued
Sub CategoryDRAMs
Access ModeDUAL BANK PAGE BURST
Access Time-Max5.5  ns
Clock Frequency-Max (fCLK)167.0  MHz
Interleaved Burst Length1,2,4,8
I/O TypeCOMMON
JESD-30 CodeR-PDSO-G50
JESD-609 Codee0
Memory Density1.6777216E7  bit
Memory IC TypeSYNCHRONOUS DRAM
Memory Width16
Number of Functions1
Number of Ports1
Number of Terminals50
Number of Words1048576.0  words
Number of Words Code1M
Operating ModeSYNCHRONOUS
Operating Temperature-Min0.0  Cel
Operating Temperature-Max70.0  Cel
Organization1MX16
Output Characteristics3-STATE
Package Body MaterialPLASTIC/EPOXY
Package CodeTSOP2
Package Equivalence CodeTSOP50,.46,32
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE, THIN PROFILE
Peak Reflow Temperature (Cel)NOT SPECIFIED
Power Supplies (V)3.3
Qualification StatusNot Qualified
Refresh Cycles2048.0
Seated Height-Max1.2  mm
Sequential Burst Length1,2,4,8,FP
Standby Current-Max0.002  Amp
Supply Current-Max0.15  Amp
Supply Voltage-Nom (Vsup)3.3  V
Supply Voltage-Min (Vsup)3.0  V
Supply Voltage-Max (Vsup)3.6  V
Surface MountYES
TechnologyCMOS
Temperature GradeCOMMERCIAL
Terminal FinishTin/Lead (Sn/Pb)
Terminal FormGULL WING
Terminal Pitch0.8  mm
Terminal PositionDUAL
Time@Peak Reflow Temperature-Max (s)NOT SPECIFIED
Length20.95  mm
Width10.16  mm
Additional FeatureAUTO/SELF REFRESH